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Sr Principal Mechanical Engr

Job Description:

The S3 RF Mechanical Design Department is seeking a mechanical engineer to perform electronics packaging design of Airborne Radar Subsystems including Active Antennas, Receivers, Exciters, Radar Processors and Power units. Tasks will include mechanical engineering throughout the hardware design life cycle, including early concept development, detailed design, oversight of production, and installation. Designs will be for tactical airborne defense environment based sensor systems and will require evaluation and allocation of military standard requirements. Typical technologies include high density printed wiring board based systems, electronic enclosures, thermal heat exchangers, machined components and RF subassemblies, adhering to design constrains such as Size, Weight, Power and design to Cost. The candidate will occasionally lead small teams through the design development and shall follow established procedures in the creation of technical data packages and design guidelines while working closely with program/functional supervision to ensure overall design objectives are completed. Candidate should possess the desire to grow and perform as a specialized engineer focused on system electronic packaging. The candidate will be required to work from requirements to develop unit design concepts and perform design trades. The candidate will be required to complete detailed layouts and design documentation using Computer Aided Design tools and Product Data Management systems. They will also be required to provide support to suppliers and/or internal manufacturing facilities who are fabricating the unit components and assemblies.

Required Skills:

  • Minimum of 10 years of experience in mechanical engineering design and product support.
  • Ability to apply basic principles, theories, and concepts within the mechanical engineering field and general knowledge of other related disciplines.
  • Direct experience in developing detail mechanical designs and documentation packages for RF, Digital, Electronic and/or mechanical systems.
  • Knowledge of design and fabrication methodologies for printed wiring boards, heat exchangers, machined components.
  • Experience in Geometric Dimensioning and Tolerance analysis for drawings.
  • Proficiency with 3D CAD solid modeling and analysis tools.
  • Ability to work independently and in a team environment, including as a leader of small teams. Shall be able to work to a budget and schedule and provide status.
  • Experience with M/S Office Tools i.e. Word, Excel, PowerPoint.
  • U.S. Citizenship is required as this position will need a U.S. DOD Secret security clearance within 1 year of start date.
  • U.S. Citizenship status is required as this position will require the ability to access US only data systems.

Desired Skills:
  • Good oral and written communication skills as well as being comfortable in making presentations.
  • Active DoD Secret security clearance with the ability to obtain additional clearances.
  • Ability to manage and complete multiple assignments with minimal supervision.
  • Prior experience in the Defense or Aerospace Industries.

Required Education:
B.S. Mechanical Engineering or related engineering field
Prefer to also have a Master's Degree


Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.

Company Name:
Security Clearance:
El Segundo, California
United States
Not Specified
Job Number:

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