Sign Up Sign Up Log In Sign Up

Sr Mechanical Engineer II - Electronic Packaging

The Mechanical Subsystems Directorate (MSD) is searching for an Electronics Packaging Design Engineer to work in our Tucson, AZ location with experience and/or an interest in the aerospace and defense industry. In this position, the candidate will be responsible for developing mechanical, electronic parts and assemblies; Circuit card assemblies (CCAs), flex harnesses and entire subassemblies, pushing the minimization limits of size, weights and cost, which will be a part of various subsystems within missiles. Duties associated could include: system requirements development, design, prototyping, manufacturing, integration and test for multiple missile programs. The candidate should have knowledge of thermal and structural design principles and how to apply them in the electronic packaging design. Familiarity with CREO and drawing standards is desired. The candidate will work with minimal direction and general supervision, while exercising considerable latitude in determining the technical objectives of the assignment. The position will require frequent interaction with senior external personnel on significant technical matters often requiring coordination between organizations. Periodic travel will be required to CCA, interconnect, machining, and flex circuit manufacturing facilities. International travel may also be required.

Note: This is a Salary Grade G09 (Sr. Mechanical Engineer II)

Required Experience and Skills:


A minimum of six (6) years of experience in the design and manufacturing of electronics packaging for military and aerospace applications
Must possess a thorough knowledge of GD&T, ANSI drawing standards and first order analysis techniques.

Ability to travel periodically to machine suppliers and CCA manufacturing facilities to support programs
Must have a working knowledge of Microsoft Office (Word, Excel, PowerPoint)
Must currently have or be able to obtain a DoD Secret Clearance
U.S. Citizenship is required

Desired Experience and Skills:


Eight (8) or more years of experience in the design and test of electronics packaging for military and aerospace applications
Familiarity with CREO(Pro/E) or similar 3D solid modeling software
(Pro/Engineer), 3D CAD modeling tool, ACAD and drawing standards
Cognizant of machine suppliers’ capabilities or have direct experience in a manufacturing and assembly support role
Familiarity with the design and manufacturing processes of CCAs, metal housings, sheet metal
Strong technical background with high technical aptitude
Strong leadership skills desire to mentor others
Very strong verbal and written communications and interpersonal skills when working with team members and customers

Advanced degree in Mechanical or Electrical Engineering


Required Education (Including Major):

Bachelor’s Degree in Mechanical or Electrical Engineering


This position requires the eligibility to obtain a security clearance. Non-US citizens may not be eligible to obtain a security clearance. The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. Employment is contingent on other factors, including, but not limited to, background checks and drug screens.
http://www.dss.mil/psmo-i/indus_psmo-i_interim.html


140582

Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.

Advertisement
Company Name:
Security Clearance:
Secret
Location:
Tucson, Arizona
Country:
United States
Salary:
Not Specified
Job Number:




Send me email alerts for similar jobs

JOIN US